| 제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
15-47-7648
|
388Kb/4P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7648
|
388Kb/4P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7648
|
35Kb/2P
|
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
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Start with "15-47-7648" -
Total : 95 ( 1/5 Page) |
Molex Electronics Ltd. |
15-47-7640
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
15-47-7640
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7640
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
15-47-7642
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7642
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7642
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
15-47-7644
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7644
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
15-47-7644
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7646
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7646
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7606
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7606
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
15-47-7606
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
15-47-7608
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
|
15-47-7608
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
|
15-47-7608
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|
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