| 제조업체 | 부품명 | 데이터시트 | 상세설명 |
Belden Inc. |
87760
|
148Kb/2P
|
Electronic, 2 C #18 Str TC, FEP Ins, OS, PVDF Jkt, CMP
01-20-2023
|
Molex Electronics Ltd. |
87760-0006
|
101Kb/3P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0416
|
167Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0417
|
166Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 4 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0616
|
167Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0617
|
166Kb/4P
|
2.00mm (.079 0.76關m (30關") Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0626
|
167Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray, Lead-free
|
|
87760-0627
|
167Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Mating Length: 3.50mm (.138), 6 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray, Lead-free
|
|
87760-0816
|
167Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0817
|
166Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-0818
|
166Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
|
|
87760-0838
|
166Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 8 Circuits, 2.54關m (100關) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
|
|
87760-1016
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1017
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1046
|
114Kb/3P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1216
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1217
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free
|
|
87760-1218
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free
|
|
87760-1226
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.50mm (.138), Tray, Lead-free
|
|
87760-1236
|
172Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits 0.38關m (15關) Gold (Au) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
|
|
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