제조업체 | 부품명 | 데이터시트 | 상세설명 |
Belden Inc. |
87761
|
158Kb/2P
|
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP
01-20-2023
|
Molex Electronics Ltd. |
87761-2001
|
308Kb/5P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
|
87761-2400
|
308Kb/5P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
|
87761-4408
|
106Kb/3P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
|
87761-5001
|
308Kb/5P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
|
87761-5021
|
309Kb/5P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
|
87761-5022
|
237Kb/4P
|
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height
|
Belden Inc. |
87761.0021000
|
158Kb/2P
|
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP
01-20-2023
|
87761.002500
|
158Kb/2P
|
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP
01-20-2023
|
87761.0025000
|
158Kb/2P
|
Electronic, 2 C #22 Str TC, FEP Ins, OS, PVDF Jkt, CMP
01-20-2023
|