제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
A-70563-0120
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225Kb/4P
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2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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Search Partnumber :
Start with "A-70563-0120" -
Total : 100 ( 1/5 Page) |
Molex Electronics Ltd. |
A-70563-0115
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225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 11 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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A-70563-0011
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225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 12 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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A-70563-0015
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225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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A-70563-0017
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225Kb/4P |
2.54mm (.100") Pitch SL Header, Single Row, Vertical, .180" Pocket, Shrouded, 18 Circuits, 0.38um
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A-70563-0050
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225Kb/4P |
2.54mm (.100) Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 16 Circuits, Tin (Sn) Plating
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A-70567-0001
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0002
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
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A-70567-0002
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0003
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
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A-70567-0003
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0004
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
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A-70567-0004
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0005
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
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A-70567-0005
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0006
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
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A-70567-0006
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0007
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
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A-70567-0007
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0008
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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