| 제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
A-70567-0102
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
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A-70567-0102
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
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A-70567-0102
|
40Kb/2P
|
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.38關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
| Search Partnumber :
Start with "A-70567-0102" -
Total : 101 ( 1/6 Page) |
Molex Electronics Ltd. |
A-70567-0100
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
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A-70567-0100
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0100
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
A-70567-0101
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38關m (15關) Gold (Au) Selective Plating,
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A-70567-0101
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0101
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
|
|
A-70567-0103
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0104
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0105
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0106
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0107
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0108
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0109
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0110
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|
A-70567-0111
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
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A-70567-0112
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
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A-70567-0113
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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