제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
A-70567-0274
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1Mb/7P
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2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
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A-70567-0274
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1Mb/7P
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2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0274
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40Kb/2P
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2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
Search Partnumber :
Start with "A-70567-0274" -
Total : 20 ( 1/1 Page) |
Molex Electronics Ltd. |
A-70567-0270
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0271
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0272
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0273
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0273
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0273
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40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
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A-70567-0275
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
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A-70567-0275
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0276
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40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
A-70567-0276
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
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A-70567-0276
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
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A-70567-0277
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
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A-70567-0277
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0277
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40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
A-70567-0278
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical,
|
A-70567-0278
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0278
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1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
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