제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
A-70567-0284
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0284
|
1Mb/7P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0284
|
40Kb/2P
|
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
Search Partnumber :
Start with "A-70567-0284" -
Total : 23 ( 1/2 Page) |
Molex Electronics Ltd. |
A-70567-0280
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0280
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0280
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0281
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0281
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0281
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0282
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0282
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0282
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0283
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0283
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0283
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0285
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
|
A-70567-0285
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
A-70567-0285
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0286
|
40Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
|
A-70567-0286
|
1Mb/7P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
|
|