제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
A-70568-0037
|
388Kb/4P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits
|
A-70568-0037
|
388Kb/4P
|
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0037
|
35Kb/2P
|
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
Search Partnumber :
Start with "A-70568-0037" -
Total : 27 ( 1/2 Page) |
Molex Electronics Ltd. |
A-70568-0030
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, Tin (Sn) Plating
|
A-70568-0030
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0030
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
A-70568-0031
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, Tin (Sn) Plating
|
A-70568-0031
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0031
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
A-70568-0032
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
A-70568-0032
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0032
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, Tin (Sn) Plating
|
A-70568-0033
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating
|
A-70568-0033
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0033
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
A-70568-0034
|
35Kb/2P |
2.54mm Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature,
|
A-70568-0034
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
A-70568-0034
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, Tin (Sn) Plating
|
A-70568-0035
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
|
A-70568-0035
|
388Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
|
|