제조업체 | 부품명 | 데이터시트 | 상세설명 |
Banner Engineering Corp... |
CIB-1
|
501Kb/8P
|
SMI30 Series Sensor
|
Samsung semiconductor |
CIB10J300
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB10P100
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB10P220
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB10P260
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB10P300
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB10P330
|
757Kb/5P
|
Chip Bead For EMI Suppression
|
CIB21J260
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21J400
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21P110
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21P150
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21P260
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21P260NE
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIB21P330
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB21P470
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIB32P600NE
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|