제조업체 | 부품명 | 데이터시트 | 상세설명 |
Samsung semiconductor |
CIM03J121
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J121
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|
CIM03J241
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J241
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03J471
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIM03J601
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIM03N300
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03N300
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|