# TG-NSP80
## Non-Silicone Thermal Putty

Version 1.171219
Non-Silicone Thermal Putty
NSP-80 is a one-part, fully cured non-silicone gap filler designed to reduce time to market and cost of ownership.

## Features
· Easily dispensable (manual, semi-automatic, or fully automatic systems)
· Full turn-key support from T-Global
· Low thermal impedance
· High thermal conductivity
· Ultra-low compression forces
· High tack and reworkable
· Proven long-term reliability

## Applications
· Consumer electronics
· Set-top boxes
· IP routers
· ECUs
· Memory and Power modules

## Properties
· REACH Compliant
· RoHS Compliant

## Technical Specifications
· Colour: Grey
· Thermal Conductivity: 8.3 W/mK
· Operating Temperature Range: -55 to +200 °C
· Viscosity @ 25°C: 1,400,000 1 sec-1, cPs
· Shelf Life: 60 months

## Packaging
· Cartridges: 30cc, 50cc, 75cc, 180cc, 360cc, 600cc
· Pails: 2.1kg, 5kg, 9kg, 25kg, 36kg

## Installation
· Full turn-key support (design, testing, supply, installation) available from T-Global.

## Contact Information
· Company: T-Global Technology (Europe & North America) Ltd.
· Address: 1 & 2 Cosford Business Park, Central Park, Lutterworth, Leicestershire LE17 4QU U.K.
· Tel: +44 (0)1455 553 510
· Email: sales@tglobaltechnology.com
· Web: www.tglobaltechnology.com