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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ENCAPSULATION 데이터시트, PDF |
| 검색된 단어 : 'ENCAPSULATION' - Total: 67 (1/4) Pages |
| 제조업체 | 부품명 | 데이터시트 | 상세설명 |
 PANDUIT CORP. |
D-300-01 | 
131Kb/7P |
CAP, SPLICE ENCAPSULATION |
| D-300-08 |
76Kb/7P |
CAP, SPLICE ENCAPSULATION | |
 Hitachi Semiconductor |
DNA1002D |
50Kb/1P |
HITACHI Encapsulation, DIP 16 |
 List of Unclassifed Man... |
SM2615FTR845 |
131Kb/2P |
High temperature molded encapsulation |
| ATC900C |
182Kb/6P |
Available with Encapsulation Option | |
 MPS Industries, Inc. |
R7X1210M |
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
 Vishay Siliconix |
WSRHP |
103Kb/4P |
Molded high temperature encapsulation Revision: 21-Oct-16 |
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List of Unclassifed Man... |
SM6227FT1R00 |
131Kb/2P |
High temperature molded encapsulation |
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MPS Industries, Inc. |
R7X1008M |
160Kb/1P |
ENCAPSULATION MOLDED CHIP INDUCTOR |
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List of Unclassifed Man... |
SM6227JT62R0 |
130Kb/2P |
High temperature molded encapsulation |
 M.S. Kennedy Corporatio... |
MSK4890 |
604Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance |
| MSK4891 |
363Kb/5P |
Proprietary Encapsulation Provides Near Hermetic Performance | |
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Vishay Siliconix |
WSCWSN |
101Kb/3P |
All welded construction, Molded encapsulation, Wraparound terminations Revision: 17-Feb-11 |
 KODENSHI_AUK CORP. |
SP217 |
153Kb/3P |
TO-5 type header with clear epoxy encapsulation |
 AVAGO TECHNOLOGIES LIMI... |
ASMT-QWBF-NKL0E |
131Kb/10P |
High reliability package with enhanced silicone resin encapsulation |
| ASMT-QYBG |
182Kb/9P |
High reliability package with enhanced silicone resin encapsulation | |
| ASMT-UYBG |
181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
| ASMT-JB11-NMP01 |
72Kb/2P |
Silicone Encapsulation for LED Advantages and Handling Precautions | |
| ASMT-UWBG |
181Kb/10P |
High reliability package with enhanced silicone resin encapsulation | |
 Sangdest Microelectroni... |
209CNQ |
140Kb/4P |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and |
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