제조업체 | 부품명 | 데이터시트 | 상세설명 |
Molex Electronics Ltd. |
0879143205
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879144405
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879143435
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|
0879144204
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879140001
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879144201
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879141001
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
0879142816
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879143016
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879110407
|
498Kb / 7P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free
|