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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ST25DV64K 데이터시트(PDF) 189 Page - STMicroelectronics |
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ST25DV64K 데이터시트(HTML) 189 Page - STMicroelectronics |
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189 / 220 page  DocID027603 Rev 4 189/220 ST25DV04K ST25DV16K ST25DV64K Package information 219 10.5 WLCSP10 package information Figure 82. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 220. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.265 0.295 0.325 0.0104 0.0116 0.0128 A1 - 0.095 - - 0.0037 - A2 - 0.175 - - 0.0069 - A3 - 0.025 - - 0.0010 - b - 0.185 - - 0.0073 - D - 1.649 1.669 - 0.0649 0.0657 E - 1.483 1.503 - 0.0584 0.0592 e - 0.400 - - 0.0157 - e1 - 0.800 - - 0.0315 - |
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