PIC12CE673-04SLASHP datasheet(115/129 Pages) MICROCHIP

115 / 129 page

DS30561B-page 115

PIC12C67X

14.0

PACKAGING INFORMATION

14.1

Package Marking Information

MMMMMMMM

XXXXXCDE

AABB

8-Lead PDIP (300 mil)

Example

8-Lead Windowed Ceramic Side Brazed (300 mil)

Example

12CE674

04/PSAZ

9925

CE674

MMMMMM

Legend: MM...M

Microchip part number information

XX...X

Customer specific information*

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Facility code of the plant at which wafer is manufactured

O = Outside Vendor

C = 5” Line

S = 6” Line

H = 8” Line

Mask revision number

Assembly code of the plant or country of origin in which

part was assembled

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask

rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with

your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

MMMMMMM

XXXXXXX

AABBCDE

8-Lead SOIC (208 mil)

Example

12C671

04I/SM

9924SAZ

PIC12CE673-04/P 데이터시트(PDF) 115 Page - Microchip Technology

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