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PIC18F4520E/MLQTP 데이터시트(PDF) 332 Page - Microchip Technology |
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PIC18F4520E/MLQTP 데이터시트(HTML) 332 Page - Microchip Technology |
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332 / 390 page ![]() PIC18F2420/2520/4420/4520 DS39631A-page 330 Preliminary 2004 Microchip Technology Inc. Supply Current (IDD)(2,3) PIC18LFX42X/X52X 250 420 µA-40°C FOSC = 1 MHZ (PRI_RUN, EC oscillator) 260 400 µA +25°C VDD = 2.0V 250 380 µA+85°C PIC18LFX42X/X52X 550 740 µA-40°C 480 700 µA +25°C VDD = 3.0V 460 670 µA+85°C All devices 1.2 1.6 mA -40°C 1.1 1.5 mA +25°C VDD = 5.0V 1.0 1.4 mA +85°C PIC18LFX42X/X52X 0.72 1.6 mA -40°C FOSC = 4 MHz (PRI_RUN, EC oscillator) 0.74 1.5 mA +25°C VDD = 2.0V 0.74 1.4 mA +85°C PIC18LFX42X/X52X 1.3 2.6 mA -40°C 1.3 2.5 mA +25°C VDD = 3.0V 1.3 2.4 mA +85°C All devices 2.7 4.7 mA -40°C 2.6 4.5 mA +25°C VDD = 5.0V 2.5 4.3 mA +85°C All devices 15 26 mA -40°C FOSC = 40 MHZ (PRI_RUN, EC oscillator) 16 25 mA +25°C VDD = 4.2V 16 24 mA +85°C All devices 21 32 mA -40°C 21 30 mA +25°C VDD = 5.0V 21 28 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LFX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in k Ω. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. |
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