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LMX2820 데이터시트(PDF) 5 Page - Texas Instruments |
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LMX2820 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 37 page 5 LMX2820 www.ti.com SNAS783 – JUNE 2020 Product Folder Links: LMX2820 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Power supply voltage –0.3 3.6 V VIN IO input voltage VCC+0.3 V TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±750 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Ambient temperature –40 85 °C TJ Junction temperature 125 °C VCC Suppy voltage 3.15 3.3 3.45 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LMX2820 UNIT RTC (VQFN) 48 PINS RθJA Junction-to-ambient thermal resistance 21.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 9.5 °C/W RθJB Junction-to-board thermal resistance 6.0 °C/W ΨJT Junction-to-top characterization parameter 0.1 °C/W ΨJB Junction-to-board characterization parameter 5.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6 °C/W 6.5 Electrical Characteristics 3.15 V ≤ VCC ≤ 3.45 V, –40°C ≤ TA ≤ 85°C. Typical values are at VCC = 3.3 V, 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER SUPPLY |
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