5

LMX2820

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SNAS783 – JUNE 2020

Product Folder Links: LMX2820

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Copyright © 2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply voltage

–0.3

3.6

V

IO input voltage

V

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

±2000

V

Charged device model (CDM), per JEDEC

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Ambient temperature

–40

85

°C

Junction temperature

125

°C

Suppy voltage

3.15

3.3

3.45

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

LMX2820

UNIT

RTC (VQFN)

48 PINS

Junction-to-ambient thermal resistance

21.5

°C/W

Junction-to-case (top) thermal resistance

9.5

°C/W

Junction-to-board thermal resistance

6.0

°C/W

Junction-to-top characterization parameter

0.1

°C/W

Junction-to-board characterization parameter

5.9

°C/W

Junction-to-case (bottom) thermal resistance

0.6

°C/W

6.5 Electrical Characteristics

3.15 V

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

POWER SUPPLY