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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32G031F6 데이터시트(PDF) 102 Page - STMicroelectronics |
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STM32G031F6 데이터시트(HTML) 102 Page - STMicroelectronics |
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102 / 117 page  Package information STM32G031x4/x6/x8 102/117 DS12992 Rev 2 6.4 UFQFPN32 package information UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package. Figure 41. UFQFPN32 package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. Table 74. UFQFPN32 package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 - - 0.050 - - 0.0020 A3 - 0.152 - - 0.0060 - b 0.180 0.230 0.280 0.0071 0.0091 0.0110 D 4.900 5.000 5.100 0.1929 0.1969 0.2008 D1 3.400 3.500 3.600 0.1339 0.1378 0.1417 D2 3.400 3.500 3.600 0.1339 0.1378 0.1417 E 4.900 5.000 5.100 0.1929 0.1969 0.2008 E1 3.400 3.500 3.600 0.1339 0.1378 0.1417 E2 3.400 3.500 3.600 0.1339 0.1378 0.1417 e - 0.500 - - 0.0197 - L 0.300 0.400 0.500 0.0118 0.0157 0.0197 ddd - - 0.080 - - 0.0031 A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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