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STM32F302K6 데이터시트(PDF) 129 Page - STMicroelectronics |
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STM32F302K6 데이터시트(HTML) 129 Page - STMicroelectronics |
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129 / 139 page ![]() DS9896 Rev 8 129/139 STM32F302x6 STM32F302x8 Package information 134 7.4 UFQFPN32 package information UFQFPN32 is 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package. Figure 46. UFQFPN32 outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. A0B8_ME_V2 1 32 PIN 1 Identifier SEATING PLANE C C ddd A A1 A2 e b D1 b E2 L e E1 E D2 L D |
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