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STM32F302C8 데이터시트(PDF) 121 Page - STMicroelectronics |
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STM32F302C8 데이터시트(HTML) 121 Page - STMicroelectronics |
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121 / 139 page ![]() DS9896 Rev 8 121/139 STM32F302x6 STM32F302x8 Package information 134 Device marking for WLCSP49 The following figure gives an example of topside marking orientation versus ball A1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 39. WLCSP49 marking example (package top view) 1. Parts marked as ES or E or accompanied by an engineering sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. STs Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 78. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. MS36424V1 Product identification(1) Date code Y WW R Revision code F302C86 |
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