D301 datasheet(358/416 Pages) MICROCHIP

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PIC24FJ256GA705 FAMILY

DS30010118D-page 358

 2016-2018 Microchip Technology Inc.

32.1

DC Characteristics

FIGURE 32-1:

PIC24FJ256GA705 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)

TABLE 32-1:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

PIC24FJ256GA705:

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal Chip Power Dissipation:

PINT = VDD x (IDD –

 IOH)

PINT + PI/O

I/O Pin Power Dissipation:

PI/O =

 ({VDD – VOH} x IOH) +  (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

JA

Frequency

(Note 1)

32 MHz

3.6V

(Note 1)

Note 1: Lower operating boundary is 2.0V or VBOR (when BOR is enabled), whichever is lower. For best

analog performance, operate above 2.2V.

PIC24FJ256GA705

TABLE 32-2:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 6x6 mm 28-Pin QFN

JA

—°C/W

(Note 1)

Package Thermal Resistance, 4x4x0.6 mm 28-Pin UQFN

JA

—°C/W

(Note 1)

Package Thermal Resistance, 7.50 mm 28-Pin SOIC

JA

—°C/W

(Note 1)

Package Thermal Resistance, 5.30 mm 28-Pin SSOP

JA

—°C/W

(Note 1)

Package Thermal Resistance, 300 mil 28-Pin SPDIP

JA

—°C/W

(Note 1)

Package Thermal Resistance, 6x6x0.5 mm 48-Pin UQFN

JA

33.7

—

°C/W

(Note 1)

Package Thermal Resistance, 10x10x1 mm 44-Pin TQFP

JA

—

°C/W

(Note 1)

Package Thermal Resistance, 7x7x1 mm 48-Pin TQFP

JA

39.3

—

°C/W

(Note 1)

Note 1:

Junction to ambient thermal resistance; Theta-JA (

JA) numbers are achieved by package simulations.

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