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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F103XC 데이터시트(PDF) 116 Page - STMicroelectronics |
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STM32F103XC 데이터시트(HTML) 116 Page - STMicroelectronics |
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116 / 143 page  Package information STM32F103xC, STM32F103xD, STM32F103xE 116/143 DS5792 Rev 13 Device marking for LFBGA144 package The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 64. LFBGA144 marking example (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity UBM 0.350 mm Dsm 0.470 mm typ. (depends on the solder mask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm to 0.125 mm Pad trace width 0.120 mm Ball Diameter 0.400 mm Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA) (continued) Dimension Recommended values |
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