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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32F103ZC 데이터시트(PDF) 118 Page - STMicroelectronics |
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STM32F103ZC 데이터시트(HTML) 118 Page - STMicroelectronics |
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118 / 143 page  Package information STM32F103xC, STM32F103xD, STM32F103xE 118/143 DS5792 Rev 13 Figure 66. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package recommended footprintoutline eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 68. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.500 mm Dsm 0.570 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.500 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 67. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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