ST25R3916 datasheet(136/157 Pages) STMICROELECTRONICS

136 / 157 page

Electrical characteristics

ST25R3916/7

136/157

DS12484 Rev 4

Electrical characteristics

5.1

Absolute maximum ratings

Any stress beyond the limits listed in Table 118 may cause permanent damage to the

device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated

in Table 118 is not implied. Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

Table 118. Absolute maximum ratings

Symbol

Parameter

Min

Max

Unit

VDD, VDD_TX(1)

1. Referenced to VSS.

Positive supply voltage

-0.3

6.0

VDD, VDD_TX(1)(2)

2. Bit sup3V set to 1 in IO configuration register 2.

Positive supply voltage when option bit sup3V is set

-0.3

∆VDD-VDD_TX(1) Difference between VDD and VDD_TX

-0.3

0.3

VDD_IO(1)

Peripheral communication supply voltage

-0.3

VGND(1)

Negative supply voltage

-0.3

0.3

VpIO(1)

Voltage for peripheral IO communication pins (27 to 32)(3)

3. Refer to Table 2 for the corresponding WLCSP balls.

-0.3

Vp5V(1)

Voltage for other pins (9, 11, 13, 14, 15 and 17)(3)

in the 5 V domain

-0.3

Vp3V(1)

Voltage for other pins (2 to 5, 7, 18, 19, 20 and 22 to 25)(3)

in the 3 V domain

-0.3

Iscr

Input current (latch-up immunity) according to JESD78

-100

100

IVDD_LDO

Maximum driver current using internal voltage regulator

350(4)

4. Provide good thermal management to ensure that junction temperature remains below the specified value.

IVDD_EXT(5)

5. VDD_RF is connected to VDD_TX to bypass the internal voltage regulator.

Peak current supplied from an external source, internal

voltage regulator bypassed

500(6)

6. Peak current with RF driver externally supplied. Provide good thermal management to ensure that junction

temperature remains below the specified value.

ESD voltage

Electrostatic discharge voltage according to JS-001,

human body model

2000

Total power dissipation (all supplies and outputs)

300

Tstrg

Storage temperature

-65

150

°C

Tbody

Package body temperature according to IPC/JEDEC

J-STD-020(7)

7. Reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices”.

260

TJun

Junction temperature

-40

125

Humidity non-condensing

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