ST25DV64K datasheet(147/197 Pages) STMICROELECTRONICS

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Table 255. SO8N – Mechanical data

Symbol

millimeters

inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

1.750

0.0689

0.100

0.250

0.0039

0.0098

1.250

0.0492

0.280

0.480

0.0110

0.0189

0.170

0.230

0.0067

0.0091

D(2)

4.800

4.900

5.000

0.1890

0.1929

0.1969

5.800

6.000

6.200

0.2283

0.2362

0.2441

E1(3)

3.800

3.900

4.000

0.1496

0.1535

0.1575

1.270

0.0500

0.250

0.500

0.0098

0.0197

0°

8°

0°

8°

0.400

1.270

0.0157

0.0500

1.040

0.0409

ccc

0.100

0.0039

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed

0.15 mm per side

3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25 mm per

side.

Note:

The package top may be smaller than the package bottom. Dimensions D and E1 are determinated at the

outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interleads flash,

but including any mismatch between the top and bottom of plastic body. Measurement side for mold flash,

protusions or gate burrs is bottom side.

Figure 79. SO8N - Footprint example

1.27

0.6 (x8)

Dimensions are expressed in millimeters.

10.2

TSSOP8 package information

This TSSOP is an 8-lead, 3 x 6.4 mm, 0.65 mm pitch, thin shrink small outline package.

ST25DV04K ST25DV16K ST25DV64K

TSSOP8 package information

DS10925 - Rev 11

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