| 전자부품 데이터시트 검색엔진 |
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STM32H7B3AI 데이터시트(PDF) 211 Page - STMicroelectronics |
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STM32H7B3AI 데이터시트(HTML) 211 Page - STMicroelectronics |
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211 / 238 page ![]() 7.8 TFBGA225 package information This TFBGA is a 225 ball, 13x13 mm, 0.8 mm pitch, fine pitch ball grid array package. Figure 103. TFBGA225 - Outline H D E E1 D1 F G e e D A B C E F K G J L M N P R 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 A1 corner index area b (225 balls) eee M f f f M A C C B C Seating plane A2 A1 A eee C BOTTOM VIEW TOP VIEW SIDE VIEW 1. Drawing is not to scale. 2. – The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heat slug. – A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. STM32H7B3xI TFBGA225 package information DS13139 - Rev 8 page 211/238 |
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