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STM32G0C1NET6 데이터시트(PDF) 125 Page - STMicroelectronics |
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STM32G0C1NET6 데이터시트(HTML) 125 Page - STMicroelectronics |
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125 / 159 page ![]() DS13564 Rev 4 125/159 STM32G0C1xC/xE Package information 154 6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6.1 UFQFPN32 package information UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package. Figure 37. UFQFPN32 package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. Table 80. UFQFPN32 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.550 0.600 0.0197 0.0217 0.0236 A1 0.000 0.020 0.050 0.000 0.0007 0.0020 A3 - 0.152 - - 0.0060 - b 0.180 0.230 0.280 0.0071 0.0091 0.0110 D(2) 4.900 5.000 5.100 0.1929 0.1969 0.2008 D1 3.400 3.500 3.600 0.1339 0.1378 0.1417 D2 3.400 3.500 3.600 0.1339 0.1378 0.1417 E(2) 4.900 5.000 5.100 0.1929 0.1969 0.2008 A0B8_ME_V3 1 32 PIN 1 Identifier SEATINGPLANE C C ddd A A1 A3 e b D1 b E2 L e E1 E D2 L D |
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