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AS1746

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

V+, INx to GND

-0.3

+7

V

COMx, NOx, NCx, to GND

-0.3

V+ +

0.3

V

COMx, NOx, NCx signals exceeding V+ or GND

are internally clamped by diodes and forward-

diode current must be limited to the maximum

current rating.

COMx, NOx, NCx

Continuous Current

-300

+300

mA

COMx, NOx, NCx

Peak Current

-400

+400

mA

Pulsed at 50% duty cycle

COMx, NOx, NCx

Peak Current

-500

+500

mA

Pulsed at 10% duty cycle

Continuous Power Dissipation

444

mW

Electro-Static Discharge

2.5

kV

HBM Mil-Std883E 3015.7 methods

Latchup Immunity

250

mA

Class II, Level A

Operating Ambient

Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).