STM32H7 datasheet(326/357 Pages) STMICROELECTRONICS

326 / 357 page

Package information

STM32H742xI/G STM32H743xI/G

326/357

DS12110 Rev 10

Notes:

Dimensioning and tolerancing schemes conform to ASME Y14.5M-2018.

TFBGA stands for thin profile fine pitch ball grid array: 1.00 mm < A ≤ 1.20 mm / fine

pitch e < 1.00 mm.

The profile height, A, is the distance from the seating plane to the highest point on the

package. It is measured perpendicular to the seating plane.

A1 is defined as the distance from the seating plane to the lowest point on the package

body.

Dimension b is measured at the maximum diameter of the terminal (ball) in a plane

parallel to primary datum C.

BSC stands for BASIC dimensions. It corresponds to the nominal value and has no

tolerance. For tolerances refer to form and position table. On the drawing these

dimensions are framed.

Primary datum C is defined by the plane established by the contact points of three or

more solder balls that support the device when it is placed on top of a planar surface.

The terminal (ball) A1 corner must be identified on the top surface of the package by

using a corner chamfer, ink or metalized markings, or other feature of package body or

Table 219. TFBGA100 - Mechanical data

Symbol

millimeters(1)

inches(12)

Min

Typ

Max

Min

Typ

Max

A(2)(3)

1.20

0.0472

A1(4)

0.15

0.0059

0.74

0.0291

b(5)

0.35

0.40

0.45

0.0138

0.0157

0.0177

D8.00 BSC(6)

0.3150 BSC

7.20 BSC

0.2835 BSC

8.00 BSC

0.3150 BSC

7.20 BSC

0.2835 BSC

e(9)

0.80 BSC

0.0315 BSC

N(11)

100

SD(12)

0.40 BSC

0.0157

SE(12)

0.40 BSC

0.0157

aaa

0.15

0.0059

ccc

0.20

0.0079

ddd

0.10

0.0039

eee

0.15

0.0059

fff

0.08

0.0031

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