STM32H7 datasheet(346/357 Pages) STMICROELECTRONICS

346 / 357 page

Package information

STM32H742xI/G STM32H743xI/G

346/357

DS12110 Rev 10

Table 230. Thermal characteristics

Symbol

Definition

Parameter

Value

Unit

ΘJA

Thermal resistance

junction-ambient

Thermal resistance junction-ambient

LQFP100 - 14 x 14 mm /0.5 mm pitch

45.0

°C/W

Thermal resistance junction-ambient

TFBGA100 - 8 x 8 mm /0.8 mm pitch

39.3

Thermal resistance junction-ambient

LQFP144 - 20 x 20 mm /0.5 mm pitch

43.7

Thermal resistance junction-ambient

UFBGA169 - 7 x 7 mm /0.5 mm pitch

37.7

Thermal resistance junction-ambient

LQFP176 - 24 x 24 mm /0.5 mm pitch

43.0

Thermal resistance junction-ambient

LQFP208 - 28 x 28 mm /0.5 mm pitch

42.4

Thermal resistance junction-ambient

UFBGA176+25 - 10 x 10 mm /0.65 mm pitch

37.4

Thermal resistance junction-ambient

TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch

36.6

ΘJB

Thermal resistance

junction-board

Thermal resistance junction-ambient

LQFP100 - 14 x 14 mm /0.5 mm pitch

36.3

°C/W

Thermal resistance junction-ambient

TFBGA100 - 8 x 8 mm /0.8 mm pitch

21.1

Thermal resistance junction-ambient

LQFP144 - 20 x 20 mm /0.5 mm pitch

38.3

Thermal resistance junction-ambient

UFBGA169 - 7 x 7 mm /0.5 mm pitch

17.3

Thermal resistance junction-ambient

LQFP176 - 24 x 24 mm /0.5 mm pitch

39.4

Thermal resistance junction-ambient

LQFP208 - 28 x 28 mm /0.5 mm pitch

40.3

Thermal resistance junction-ambient

UFBGA176+25 - 10 x 10 mm /0.65 mm pitch

19.3

Thermal resistance junction-ambient

TFBGA240+25 - 14 x 14 mm / 0.8 mm pitch

24.3

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