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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ST72104G2 데이터시트(PDF) 132 Page - STMicroelectronics |
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ST72104G2 데이터시트(HTML) 132 Page - STMicroelectronics |
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132 / 140 page  ST72104G, ST72215G, ST72216G, ST72254G 132/140 15.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines in Figure 99 and Figure 100. Recommended glue for SMD plastic packages dedicated to molding compound with silicone: s Heraeus: PD945, PD955 s Loctite: 3615, 3298 Figure 99. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 100. Recommended Reflow Soldering Oven Profile (MID JEDEC) 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=220+/-5°C for 25 sec |
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