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PIC16F883-E/SOSQTP 데이터시트(PDF) 271 Page - Microchip Technology |
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PIC16F883-E/SOSQTP 데이터시트(HTML) 271 Page - Microchip Technology |
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271 / 288 page ![]() © 2007 Microchip Technology Inc. Preliminary DS41291D-page 269 PIC16F882/883/884/886/887 40-Lead Plastic Dual In-Line (P or PL) – 600 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 40 Pitch e .100 BSC Top to Seating Plane A – – .250 Molded Package Thickness A2 .125 – .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .590 – .625 Molded Package Width E1 .485 – .580 Overall Length D 1.980 – 2.095 Tip to Seating Plane L .115 – .200 Lead Thickness c .008 – .015 Upper Lead Width b1 .030 – .070 Lower Lead Width b .014 – .023 Overall Row Spacing § eB – – .700 N NOTE 1 E1 D 12 3 A A1 b1 b e c eB E L A2 Microchip Technology Drawing C04-016B |
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