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PIC12F615-E/ST 데이터시트(PDF) 156 Page - Microchip Technology

부품명 PIC12F615-E/ST
상세설명  8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PDF  168 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC12F615-E/ST 데이터시트(HTML) 156 Page - Microchip Technology

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PIC12F609/615/12HV609/615
DS41302A-page 154
Preliminary
© 2006 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body (TSSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
D
e
n
b
2
1
c
L
A
A1
A2
ϕ
β
α
MILLIMETERS*
MIN
NOM
MAX
1.20
1.05
0.15
4.50
3.10
0.75
8°
0.20
0.30
8
–
1.00
–
4.40
3.00
0.60
–
–
–
–
0.80
0.05
4.30
2.90
0.45
0°
0.09
0.19
INCHES
MIN
NOM
MAX
8
–
.039
–
.173
.118
.024
–
–
–
.047
.041
.006
.177
.122
.030
8°
.008
.012
–
.031
.002
.169
.114
.018
0°
.004
.007
.026 BSC
0.65 BSC
.252 BSC
6.40 BSC
12° REF
12° REF
12° REF
12° REF
Units
Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
1. Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-086
Revised 7-25-06
n
e
A
A2
A1
E
E1
D
L
ϕ
c
b
α
β



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