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I.MX93 데이터시트(PDF) 2 Page - NXP Semiconductors

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상세설명  i.MX 93 Application Processors Data Sheet for Automotive Products
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제조업체  NXP [NXP Semiconductors]
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i.MX 93 Application Processors Data Sheet for Automotive Products, Rev. 3, 12/2023
2
NXP Semiconductors
i.MX 93 introduction
Table 1. Features (Sheet 1 of 3)
Subsystem
Features
Cortex®-A55 MPCore platform
Two Cortex®-A55 processors operating up to 1.7 GHz
• 32 KB L1 Instruction Cache
• 32 KB L1 Data Cache
• 64 KB per-core L2 cache
• Media Processing Engine (MPE) with Arm® NeonTM technology supporting the
Advanced Single Instruction Multiple Data architecture
• Floating Point Unit (FPU) with support of the Arm® VFPv4-D16 architecture
Support of 64-bit Arm® v8.2-A architecture
256 KB cluster L3 cache
Parity/ECC protection on L1 cache, L2 cache, and TLB RAMs
Cortex®-M33 core platform
• Stand by monitoring with Cortex®-A55 and other high-power modules power
gated
Cortex®-M33 CPU operating up to 250 MHz
• Support FPU
• Support MPU
• Support NVIC
• Support FPB
• Support DWT and ITM
• Two-way set-associative 16 KB System Cache with parity support
• Two-way set-associative 16 KB Code Cache with parity support
• 256 KB tightly coupled memory (TCM)
Neural Processing Unit (NPU)
Neural Network performance (256 MACs operating up to 1.0 GHz and 2 OPS/MAC)
• NPU targets 8-bit and 16-bit integer RNN
• Handles 8-bit weights
Image Sensor Interface (ISI)
• Standard pixel formats commonly used in many camera input protocols
• Programmable resolutions up to 2K
• Image processing for:
•Supports one source of up to 2K horizontal resolution
•Supports pixel rate up to 200 Mpixel/s
• Image down scaling via decimation and bi-phase filtering
• Color space conversion
• Interlaced to progressive conversions
On-chip memory
Boot ROM (256 KB) for Cortex®-A55
Boot ROM (256 KB) for Cortex®-M33
On-chip RAM (640 KB)
General Business Information


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