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I.MX93 데이터시트(PDF) 1 Page - NXP Semiconductors

부품명 I.MX93
상세설명  i.MX 93 Application Processors Data Sheet for Automotive Products
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제조업체  NXP [NXP Semiconductors]
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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX93AEC
Rev. 3, 12/2023
MIMX9352AVTXMAB
MIMX9351AVXMAB
MIMX9332AVTXMAB
MIMX9331AVTXMAB
Package Information
Plastic Package
FCBGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 2 on page 5
NXP reserves the right to change the production detail specifications as may be required to permit
improvements in the design of its products.
© 2023 NXP Semiconductors. All rights reserved.
1
i.MX 93 introduction
The i.MX 93 family represents NXP’s latest
power-optimized processors for smart home, building
control, contactless HMI, IoT edge, Automotive, and
Industrial applications.
The i.MX 93 includes powerful dual Arm® Cor-
tex®-A55 processors with speeds up to 1.7 GHz inte-
grated with a NPU that accelerates machine learning
inference. A general-purpose Arm® Cortex®-M33 run-
ning up to 250 MHz is for real-time and low-power pro-
cessing. Robust control networks are possible via
CAN-FD interface. Also, dual 1 Gbps Ethernet control-
lers, one supporting Time Sensitive Networking (TSN),
drive gateway applications with low latency.
The i.MX 93 Automotive qualified part is particularly
useful for applications such as:
Driver monitoring system (DMS)
Cost optimized gateway
General purpose compute
i.MX 93 Application
Processors Data Sheet
for Automotive Products
1. i.MX 93 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4
2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1. Special signal considerations . . . . . . . . . . . . . . . 13
3.2. Unused input and output guidance . . . . . . . . . . . 13
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15
4.2. Power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3. Power supplies requirements and restrictions . . . 26
4.4. PLL electrical characteristics . . . . . . . . . . . . . . . . 27
4.5. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 28
4.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 30
4.7. Differential I/O output buffer impedance . . . . . . . 32
4.8. System modules timing . . . . . . . . . . . . . . . . . . . . 32
4.9. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 37
4.10. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.11. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.12. External peripheral interface parameters . . . . . . . 49
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 85
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 85
5.2. Boot device interface allocation . . . . . . . . . . . . . . 86
6. Package information and contact assignments . . . . . . . 90
6.1. 14 x 14 mm package information . . . . . . . . . . . . . 90
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
General Business Information


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