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I.MX93 데이터시트(PDF) 1 Page - NXP Semiconductors |
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I.MX93 데이터시트(HTML) 1 Page - NXP Semiconductors |
1 / 112 page NXP Semiconductors Data Sheet: Technical Data Document Number: IMX93AEC Rev. 3, 12/2023 MIMX9352AVTXMAB MIMX9351AVXMAB MIMX9332AVTXMAB MIMX9331AVTXMAB Package Information Plastic Package FCBGA 14 x 14 mm, 0.65 mm pitch Ordering Information See Table 2 on page 5 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. © 2023 NXP Semiconductors. All rights reserved. 1 i.MX 93 introduction The i.MX 93 family represents NXP’s latest power-optimized processors for smart home, building control, contactless HMI, IoT edge, Automotive, and Industrial applications. The i.MX 93 includes powerful dual Arm® Cor- tex®-A55 processors with speeds up to 1.7 GHz inte- grated with a NPU that accelerates machine learning inference. A general-purpose Arm® Cortex®-M33 run- ning up to 250 MHz is for real-time and low-power pro- cessing. Robust control networks are possible via CAN-FD interface. Also, dual 1 Gbps Ethernet control- lers, one supporting Time Sensitive Networking (TSN), drive gateway applications with low latency. The i.MX 93 Automotive qualified part is particularly useful for applications such as: • Driver monitoring system (DMS) • Cost optimized gateway • General purpose compute i.MX 93 Application Processors Data Sheet for Automotive Products 1. i.MX 93 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1. Special signal considerations . . . . . . . . . . . . . . . 13 3.2. Unused input and output guidance . . . . . . . . . . . 13 4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 15 4.2. Power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 4.3. Power supplies requirements and restrictions . . . 26 4.4. PLL electrical characteristics . . . . . . . . . . . . . . . . 27 4.5. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 28 4.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 30 4.7. Differential I/O output buffer impedance . . . . . . . 32 4.8. System modules timing . . . . . . . . . . . . . . . . . . . . 32 4.9. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 37 4.10. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 4.11. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 4.12. External peripheral interface parameters . . . . . . . 49 5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 85 5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 85 5.2. Boot device interface allocation . . . . . . . . . . . . . . 86 6. Package information and contact assignments . . . . . . . 90 6.1. 14 x 14 mm package information . . . . . . . . . . . . . 90 7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 General Business Information |
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