I.MX93 datasheet(1/143 Pages) NXP

부품명	I.MX93

상세설명	i.MX 93 Application Processors Data Sheet for Industrial Products

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX93IEC

Rev. 3, 12/2023

MIMX9352CVVXMAB

MIMX9351CVVXMAB

MIMX9332CVVXMAB

MIMX9331CVVXMAB

MIMX9302CVVXDAB

MIMX9301CVVXDAB

MIMX9322CVXXMAB

MIMX9321CVXXMAB

MIMX9312CVXXMAB

MIMX9311CVXXMAB

MIMX9352CVTXMAB

MIMX9351CVTXMAB

MIMX9332CVTXMAB

MIMX9331CVTXMAB

Package Information

Plastic Package

FCBGA 11 x 11 mm, 0.5 mm pitch

FCBGA 9 x 9 mm, 0.5 mm pitch

FCBGA 14 x 14 mm, 0.65 mm pitch

Ordering Information

See Table 2 on page 5

NXP reserves the right to change the production detail specifications as may be required to permit

improvements in the design of its products.

1

i.MX 93 introduction

The i.MX 93 family represents NXP’s latest

power-optimized processors for smart home, building

control, contactless HMI, IoT edge, Automotive, and

Industrial applications.

The i.MX 93 includes powerful dual Arm® Cor-

tex®-A55 processors with speeds up to 1.7 GHz inte-

grated with a NPU that accelerates machine learning

inference. A general-purpose Arm® Cortex®-M33 run-

ning up to 250 MHz is for real-time and low-power pro-

cessing. Robust control networks are possible via

CAN-FD interface. Also, dual 1 Gbps Ethernet control-

lers, one supporting Time Sensitive Networking (TSN),

drive gateway applications with low latency.

The i.MX 93 Industrial qualified part is particularly

useful for applications such as:

•

Industrial human machine interface (HMI)

•

Industrial vision

•

Scanning and printing

•

EV Charging

i.MX 93 Application

Processors Data Sheet

for Industrial Products

1. i.MX 93 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 4

2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1. Special signal considerations . . . . . . . . . . . . . . . 14

3.2. Unused input and output guidance . . . . . . . . . . . 14

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 16

4.2. Power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.3. Power supplies requirements and restrictions . . . 28

4.4. PLL electrical characteristics . . . . . . . . . . . . . . . . 29

4.5. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 30

4.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 32

4.7. Differential I/O output buffer impedance . . . . . . . 34

4.8. System modules timing . . . . . . . . . . . . . . . . . . . . 34

4.9. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 39

4.10. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

4.11. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

4.12. External peripheral interface parameters . . . . . . . 52

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 88

5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 88

5.2. Boot device interface allocation . . . . . . . . . . . . . . 89

6. Package information and contact assignments . . . . . . . 93

6.1. 11 x 11 mm package information . . . . . . . . . . . . . 93

6.2. 9 x 9 mm package information . . . . . . . . . . . . . . 109

6.3. 14 x 14 mm package information . . . . . . . . . . . . 120

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

General Business Information

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NXP Semiconductors	I.MX93	2Mb / 126P	i.MX 93 Application Processors Data Sheet for Commercial Products Rev. 3, 12/2023

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