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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ST72321AR 데이터시트(PDF) 174 Page - STMicroelectronics |
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ST72321AR 데이터시트(HTML) 174 Page - STMicroelectronics |
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174 / 189 page  ST72321 174/189 13.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines. Figure 104. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 105. Recommended Reflow Soldering Oven Profile (MID JEDEC) Recommended glue for SMD plastic packages dedicated to molding compound with silicone: ■ Heraeus: PD945, PD955 ■ Loctite: 3615, 3298 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=235+/-5°C for 25 sec |
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