ST10F273 datasheet(128/179 Pages) STMICROELECTRONICS

128 / 179 page

Electrical characteristics

ST10F273

128/179

Based on thermal characteristics of the package and with reference to the power

consumption figures provided in next tables and diagrams, the following product

classification can be proposed. Anyhow, the exact power consumption of the device inside

the application must be computed according to different working conditions, thermal profiles,

real thermal resistance of the system (including printed circuit board or other substrata), I/O

activity, and so on.

24.4

Parameter interpretation

The parameters listed in the following tables represent the characteristics of the ST10F273

and its demands on the system.

Where the ST10F273 logic provides signals with their respective timing characteristics, the

symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where the

external system must provide signals with their respective timing characteristics to the

ST10F273, the symbol “SR” for System Requirement, is included in the “Symbol” column.

Table 62.

Thermal characteristics

Symbol

Description

Value (typical)

Unit

ΘJA

Thermal resistance junction-ambient

PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch

LQFP 144 - 20 x 20 mm / 0.5 mm pitch

LQFP 144 - 20 x 20 mm / 0.5 mm pitch on four layer

FR4 board (2 layers signals / 2 layers power)

°C/W

Table 63.

Product classification

Package

Ambient temperature range

CPU frequency range

Die

–40°C to +125°C

1 to 64 MHz

PQFP 144

–40°C to +125°C

1 to 64 MHz

LQFP 144

–40°C to +125°C

1 to 40 MHz

–40°C to +105°C

1 to 48 MHz

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