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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PIC12LF1501 데이터시트(PDF) 346 Page - Microchip Technology |
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PIC12LF1501 데이터시트(HTML) 346 Page - Microchip Technology |
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346 / 352 page  PIC16(L)F1503 DS40001607D-page 346 2011-2015 Microchip Technology Inc. RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Y2 SILK SCREEN Y1 C2 X2 Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 1.70 1.70 MILLIMETERS 0.50 BSC MIN E MAX 2.90 Contact Pad Length (X16) Contact Pad Width (X16) Y1 X1 0.80 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2211A NOM 16-Lead Ultra Thin Quad Flat Pack, No Lead (MV) - 3x3x0.50 mm Body (UQFN) E X1 C2 Contact Pad Spacing C1 2.90 |
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