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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LSF0108 데이터시트(PDF) 192 Page - Nexperia B.V. All rights reserved |
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LSF0108 데이터시트(HTML) 192 Page - Nexperia B.V. All rights reserved |
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192 / 234 page  Nexperia selection guide 2020 192 Minimized outline drawings and reflow soldering footprint References Outline version European projection Issue date IEC JEDEC JEITA SOD992 sod992_po 13-10-28 13-11-01 Unit mm max nom min 0.14 0.42 0.12 0.17 0.25 0.40 0.38 A Dimensions (mm are the original dimensions) E D 0.22 0.10 0.15 0.18 L b e 0 0.5 mm scale A E D L L b (2x) 1 2 e 0.12 0.20 0.11 0.16 0.10 occupied area solder paste solder resist solder lands Dimensions in mm 14-08-22 14-08-25 0.23 (2x) 0.18 (2x) 0.20 (2x) 0.16 0.66 0.56 0.36 0.33 0.38 occupied area solder paste solder resist solder lands Dimensions in mm 14-08-22 14-08-25 0.23 (2x) 0.18 (2x) 0.20 (2x) 0.16 0.66 0.56 0.36 0.33 0.38 DSN0402-2 (SOD992) DSN0402-2 (SOD992) 2-pin SMD packages Dimensions in mm Images are for reference only, for detailed drawings please visit nexperia.com/packages DSN0402B (SOD992B) DSN0402B (SOD992B) Nexperia SOD962B silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 x 0.3 x 0.2 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD962B - - - sod962b_po 17-01-16 17-08-04 Unit mm max nom min 0.22 0.18 0.03 0.325 0.275 0.625 0.575 0.4 0.15 0.13 A(2) Dimensions (mm are the original dimensions) Note 1. The marking bar indicates the cathode. 2. Dimension A is including coating foil thickness. Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.2 mm SOD962B A1 b 0.25 0.23 D E e1 L 0 0.5 mm scale A A1 E D (1) e1 L (2x) b (2x) 1 2 Fig. 1. Package outline DSN0603B-2 (SOD962B) SOD962B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 2 / 5 Nexperia SOD962B silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 x 0.3 x 0.2 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD962B - - - sod962b_po 17-01-16 17-08-04 Unit mm max nom min 0.22 0.18 0.03 0.325 0.275 0.625 0.575 0.4 0.15 0.13 A(2) Dimensions (mm are the original dimensions) Note 1. The marking bar indicates the cathode. 2. Dimension A is including coating foil thickness. Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.2 mm SOD962B A1 b 0.25 0.23 D E e1 L 0 0.5 mm scale A A1 E D (1) e1 L (2x) b (2x) 1 2 Fig. 1. Package outline DSN0603B-2 (SOD962B) SOD962B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 2 / 5 DSN0603B-2 (SOD962B) DSN0603B-2 (SOD962B) Nexperia SOD962B silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 x 0.3 x 0.2 mm body 3. Soldering Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962B sod962b_fr occupied area solder paste solder lands Dimensions in mm 17-01-16 17-08-04 0.676 0.16 0.2 0.4 0.2 0.2 0.256 0.256 0.6 0.85 0.28 0.4 Fig. 2. Reflow soldering footprint for DSN0603B-2 (SOD962B) SOD962B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 3 / 5 Nexperia SOD962B silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 x 0.3 x 0.2 mm body 3. Soldering Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962B sod962b_fr occupied area solder paste solder lands Dimensions in mm 17-01-16 17-08-04 0.676 0.16 0.2 0.4 0.2 0.2 0.256 0.256 0.6 0.85 0.28 0.4 Fig. 2. Reflow soldering footprint for DSN0603B-2 (SOD962B) SOD962B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 3 / 5 DSN0603-2 (SOD962-2) DSN0603-2 (SOD962-2) Nexperia SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 3. Soldering Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 sod962-2_fr occupied area solder paste solder lands Dimensions in mm 14-06-12 16-02-01 0.676 0.16 0.2 0.4 0.2 0.2 0.256 0.256 0.6 0.85 0.28 0.4 Fig. 2. Reflow soldering footprint for DSN0603-2 (SOD962-2) SOD962-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 3 / 5 Nexperia SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 3. Soldering Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 sod962-2_fr occupied area solder paste solder lands Dimensions in mm 14-06-12 16-02-01 0.676 0.16 0.2 0.4 0.2 0.2 0.256 0.256 0.6 0.85 0.28 0.4 Fig. 2. Reflow soldering footprint for DSN0603-2 (SOD962-2) SOD962-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 3 / 5 Nexperia SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD962-2 sod962-2_po 13-07-12 13-07-17 Unit mm max nom min 0.32 0.28 0.03 0.325 0.275 0.625 0.575 0.4 0.15 0.13 A Dimensions (mm are the original dimensions) Note 1. The marking bar indicates the cathode. Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 A1 b 0.25 0.23 D E e1 L 0 0.5 mm scale A A1 E D (1) e1 L b 1 2 Fig. 1. Package outline DSN0603-2 (SOD962-2) SOD962-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 2 / 5 Nexperia SOD962-2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD962-2 sod962-2_po 13-07-12 13-07-17 Unit mm max nom min 0.32 0.28 0.03 0.325 0.275 0.625 0.575 0.4 0.15 0.13 A Dimensions (mm are the original dimensions) Note 1. The marking bar indicates the cathode. Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm SOD962-2 A1 b 0.25 0.23 D E e1 L 0 0.5 mm scale A A1 E D (1) e1 L b 1 2 Fig. 1. Package outline DSN0603-2 (SOD962-2) SOD962-2 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 5 June 2018 2 / 5 Nexperia SOD992B silicon, leadless tiny package; 2 terminals; 0.28 mm pitch; 0.43 mm x 0.23 mm x 0.12 mm body 3. Soldering Footprint information for reflow soldering of DSN0402B-2, leadless tiny package; 2 terminals SOD992B sod992b_fr occupied area solder land solder paste Dimensions in mm 19-02-06 19-04-03 0.55 Cu pads (solder lands) are connected by micro-vias recommend stencil thickness: 0.08 mm 0.15 0.13 0.13 0.28 R 0.065 via Ø0.085 0.2 0.35 Fig. 2. Reflow soldering footprint for DSN0402B (SOD992B) SOD992B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 3 October 2019 3 / 5 Nexperia SOD992B silicon, leadless tiny package; 2 terminals; 0.28 mm pitch; 0.43 mm x 0.23 mm x 0.12 mm body 3. Soldering Footprint information for reflow soldering of DSN0402B-2, leadless tiny package; 2 terminals SOD992B sod992b_fr occupied area solder land solder paste Dimensions in mm 19-02-06 19-04-03 0.55 Cu pads (solder lands) are connected by micro-vias recommend stencil thickness: 0.08 mm 0.15 0.13 0.13 0.28 R 0.065 via Ø0.085 0.2 0.35 Fig. 2. Reflow soldering footprint for DSN0402B (SOD992B) SOD992B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 3 October 2019 3 / 5 Nexperia SOD992B silicon, leadless tiny package; 2 terminals; 0.28 mm pitch; 0.43 mm x 0.23 mm x 0.12 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD992B - - - sod992b_po 18-08-21 18-08-22 Unit mm max nom min 0.14 0.46 0.15 0.22 0.28 0.43 0.40 A Dimensions (mm are the original dimensions) DSN0402B-2, leadless tiny package; 2 terminals SOD992B E D 0.26 0.11 0.18 0.20 L b e 0 0.5 mm scale A E D L L b (2x) 1 2 optional feature (polarity indicator) side view e 0.12 0.23 0.13 0.20 0.10 X detail X top view bottom view Fig. 1. Package outline DSN0402B (SOD992B) SOD992B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 3 October 2019 2 / 5 Nexperia SOD992B silicon, leadless tiny package; 2 terminals; 0.28 mm pitch; 0.43 mm x 0.23 mm x 0.12 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOD992B - - - sod992b_po 18-08-21 18-08-22 Unit mm max nom min 0.14 0.46 0.15 0.22 0.28 0.43 0.40 A Dimensions (mm are the original dimensions) DSN0402B-2, leadless tiny package; 2 terminals SOD992B E D 0.26 0.11 0.18 0.20 L b e 0 0.5 mm scale A E D L L b (2x) 1 2 optional feature (polarity indicator) side view e 0.12 0.23 0.13 0.20 0.10 X detail X top view bottom view Fig. 1. Package outline DSN0402B (SOD992B) SOD992B All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. All rights reserved Package information 3 October 2019 2 / 5 |
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