| 전자부품 데이터시트 검색엔진 |
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L9945 데이터시트(PDF) 135 Page - STMicroelectronics |
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L9945 데이터시트(HTML) 135 Page - STMicroelectronics |
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135 / 144 page ![]() Table 53. TQFP64 (10x10x1 mm exp. pad down) package mechanical data Ref Min. Typ. Max. Note (see # in Notes below) Ө 0° 3.5° 7° - Ө1 0° - - - Ө2 11° 12° 13° - Ө3 11° 12° 13° - A - - 1.2 15 A1 0.05 - 0.15 12 A2 0.95 1 1.05 15 b 0.17 0.22 0.27 9, 11 b1 0.17 0.2 0.23 11 c 0.09 - 0.2 11 c1 0.09 - 0.16 11 D - 12.00 BSC - 4 D1 - 10.00 BSC - 5, 2 D2 - - 6.4 13 D3 4.8 - - 14 e - 0.50 BSC - - E - 12.00 BSC - 4 E1(*) - 10.00 BSC - 5, 2 E2 - - 6.4 13 E3 4.8 - - 14 L 0.45 0.6 0.75 - L1 - 1.00 REF - - N - 64 - 16 R1 0.08 - - - R2 0.08 - 0.2 - S 0.2 - - - Tolerance of form and position aaa - 0.2 - 1, 7 bbb - 0.2 - ccc - 0.08 - ddd - 0.08 - Notes 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994. 2. The Top package body size may be smaller than the bottom package size up to 0.15 mm. 3. Datum A-B and D to be determined at datum plane H. 4. To be determined at seating datum plane C. 5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch. 6. Details of pin 1 identifier are optional but must be located within the zone indicated. 7. All Dimensions are in millimeters. L9945 Package information DS12275 - Rev 10 page 135/144 |
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