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STM32H533CEU6TR 데이터시트(PDF) 224 Page - STMicroelectronics

부품명 STM32H533CEU6TR
상세설명  Arm® Cortex®-M33 32-bit MCUTrustZone® FPU, 375 DMIPS 250 MHz, 512-Kbyte flash, 272-Kbyte RAM, cryptography
PDF  231 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STM32H533CEU6TR 데이터시트(HTML) 224 Page - STMicroelectronics

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Package information
STM32H533xx
224/231
DS14539 Rev 1
Notes:
1.
Dimensioning and tolerancing schemes conform to ASME Y14.5M-2009 apart
European projection.
2.
UFBGA stands for ulta profile fine pitch ball grid array: 0.50 mm < A ≤ 0.65 mm / fine
pitch e < 1.00 mm.
3.
The profile height, A, is the distance from the seating plane to the highest point on the
package. It is measured perpendicular to the seating plane.
4.
A1 is defined as the distance from the seating plane to the lowest point on the package
body.
5.
Dimension b is measured at the maximum diameter of the terminal (ball) in a plane
parallel to primary datum C.
6.
BSC stands for BASIC dimensions. It corresponds to the nominal value and has no
tolerance. For tolerances refer to form and position table. On the drawing these
dimensions are framed.
7.
Primary datum C is defined by the plane established by the contact points of three or
more solder balls that support the device when it is placed on top of a planar surface.
8.
The terminal (ball) A1 corner must be identified on the top surface of the package by
using a corner chamfer, ink or metalized markings, or other feature of package body or
Table 128. UFBGA144 - Mechanical data
Symbol
millimeters(1)
inches(12)
Min.
Typ.
Max.
Min.
Typ.
Max.
A(2)(3)
-
-
0.60
-
-
0.0236
A1(4)
0.05
-
-
0.0020
-
-
A2
-
0.43
-
-
0.0169
-
b(5)
0.35
0.40
0.45
0.0138
0.0157
0.0177
D
10.00 BSC(6)
0.3937 BSC
D1
8.80 BSC
0.3465 BSC
E
10.00 BSC
0.3937 BSC
E1
8.80 BSC
0.3465 BSC
e(9)
0.80 BSC
0.0315 BSC
N(11)
144
SD(12)
0.40 BSC
0.0157 BSC
SE(12)
0.40 BSC
0.0157 BSC
aaa
0.15
0.0059
ccc
0.20
0.0079
ddd
0.10
0.0039
eee
0.15
0.0059
fff
0.08
0.0031



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