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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MPC8536AVTAVL 데이터시트(PDF) 125 Page - Freescale Semiconductor, Inc |
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MPC8536AVTAVL 데이터시트(HTML) 125 Page - Freescale Semiconductor, Inc |
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125 / 128 page  Mechanical Dimensions of the MPC8536E FC-PBGA MPC8536E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 125 5.2 Mechanical Dimensions of the MPC8536E FC-PBGA The mechanical dimensions and bottom surface nomenclature of the MPC8536E, 783 FC-PBGA package are shown in Figure 81. Figure 81. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC8536E FC-PBGA NOTES for Figure 81 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Maximum solder ball diameter measured parallel to datum A 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Capacitors may not be present on all devices 6. Caution must be taken not to short exposed metal capacitor pads on package top. 7. All dimensions are symmetric across the package center lines, unless dimensioned otherwise. |
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