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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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QBW018A0B61-HTZ 데이터시트(PDF) 10 Page - Lineage Power Corporation |
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QBW018A0B61-HTZ 데이터시트(HTML) 10 Page - Lineage Power Corporation |
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10 / 14 page  Data Sheet March 27, 2008 QBW018A0B1-TZ Series Power Modules; DC-DC converters 36-75Vdc Input; 12Vdc Output; 18A Output Current LINEAGE POWER 10 0 5 10 15 20 0 2040 6080 100 1m/s (200LFM) 3m/s (600LFM) 2m/s (400LFM) LOCAL AMBIENT TEMPERATURE, TA (°C) Figure 16. Output Current Derating for QBW018A0B-TZ in the Transverse Orientation with baseplate and 0.25-inch high heatsink; Airflow Direction From Vin(–) to Vout(+); Vin = 48V Layout Considerations The QBW018 power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. For additional layout guide-lines, refer to the PIM200X and FLT007A0 Input Filter Module data sheets. Post solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note. Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3 °C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210 °C. For Pb solder, the recommended pot temperature is 260 °C, while the Pb-free solder pot is 270 °C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details. LOCAL AMBIENT TEMPERATURE, TA (°C) Figure 17. Output Current Derating for QBW018A0B- TZ in the Transverse Orientation with baseplate and 0.5-inch high heatsink; Airflow Direction From Vin(–) to Vout(+); Vin = 48V 0 5 10 15 20 0 2040 6080 100 1m/s (200LFM) 3m/s (600LFM) 2m/s (400LFM) |
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