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TMP320C6720RFP300 데이터시트(PDF) 109 Page - Texas Instruments

부품명 TMP320C6720RFP300
상세설명  Floating-Point Digital Signal Processors
PDF  118 Pages
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제조업체  TI [Texas Instruments]
홈페이지  http://www.ti.com
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TMP320C6720RFP300 데이터시트(HTML) 109 Page - Texas Instruments

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Mechanical Data
7.1 Package Thermal Resistance Characteristics
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processors
www.ti.com
SPRS370E – SEPTEMBER 2006 – REVISED JULY 2008
Table 7-1 and Table 7-2 provide the thermal characteristics for the recommended package types used on
the TMS320C672x DSP.
Table 7-1. Thermal Characteristics for GDH/ZDH Package
AIR FLOW
NO.
°C/W
(m/s)
Two-Signal, Two-Plane, 101.5 x 114.5 x 1.6 mm , 2-oz Cu. EIA/JESD51-9 PCB
1
R
θ
JA
Thermal Resistance Junction to Ambient
25
0
2
R
θ
JB
Thermal Resistance Junction to Board
14.5
0
3
R
θ
JC
Thermal Resistance Junction to Top of Case
10
0
4
ΨJB
Thermal Metric Junction to Board
14
0
5
ΨJT
Thermal Metric Junction to Top of Case
0.39
0
Table 7-2. Thermal Characteristics for RFP Package
THERMAL PAD CONFIGURATION
AIR
NO.
°C/W
FLOW
VIA
TOP
BOTTOM
(m/s)
ARRAY
Two-Signal, Two-Plane, 76.2 x 76.2 mm PCB(1)(2)(3)
1
R
θ
JA
Thermal Resistance Junction to Ambient
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
20
0
7.5 x 7.5 mm
7.5 x 7.5 mm
5 x 5
22
0
2
ΨJP
Thermal Metric Junction to Power Pad
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
0.39
0
Double-Sided 76.2 x 76.2 mm PCB(1) (2)(4)
3
R
θ
JA
Thermal Resistance Junction to Ambient
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
49
0
10.6 x 10.6 mm
38.1 x 38.1 mm
6 x 6
27
0
10.6 x 10.6 mm
57.2 x 57 mm
6 x 6
22
0
10.6 x 10.6 mm
76.2 x 76.2 mm
6 x 6
20
0
4
ΨJP
Thermal Metric Junction to Power Pad
10.6 x 10.6 mm
10.6 x 10.6 mm
6 x 6
0.39
0
(1)
PCB modeled with 2 oz/ft2 Top and Bottom Cu.
(2)
Package thermal pad must be properly soldered to top layer PCB thermal pad for both thermal and electrical performance. Thermal pad
is VSS.
(3)
Top layer thermal pad is connected through via array to both bottom layer thermal pad and internal VSS plane.
(4)
Top layer thermal pad is connected through via array to bottom layer thermal pad.
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Mechanical Data
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