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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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I.MX27 데이터시트(PDF) 4 Page - Freescale Semiconductor, Inc |
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I.MX27 데이터시트(HTML) 4 Page - Freescale Semiconductor, Inc |
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4 / 148 page  i.MX27 and i.MX27L Data Sheet, Rev. 1.5 4 Freescale Semiconductor Functional Description and Application Information 1.3 Ordering Information Table 1 provides ordering information for the MAPBGA, lead-free packages. 2 Functional Description and Application Information 2.1 ARM926 Microprocessor Core Platform The ARM926 Platform consists of the ARM926EJ-S processor, ETM9, ETB9, a 6 × 3 Multi-Layer AHB crossbar switch (MAX), and a “primary AHB” complex. • The instruction bus (I-AHB) of the ARM926EJ-S processor is connected directly to MAX Master Port 0. • The data bus (D-AHB) of the ARM926EJ-S processor is connected directly to MAX Master Port 1. Four alternate bus master interfaces are connected to MAX Master Ports 2–5. Three slave ports of the MAX are AHB-Lite compliant buses. Slave Port 0 is designated as the “primary” AHB. The primary AHB is internal to the platform and has five slaves connected to it: the AITC interrupt module, the MCTL memory controller, and two AIPI peripheral interface gaskets. Slave Ports 1 and 2 of the MAX are referred to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform. The ARM926EJ-S processor supports the 32-bit and 16-bit ARM Thumb instruction sets, enabling the user to trade off between high performance and high-code density. The ARM926EJ-S processor includes features for efficient execution of Java byte codes, providing Java performance similar to the just-in-time (JIT) compiler—which is a type of Java compiler—but without the associated code overhead. The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both hardware and software debugging. The ARM926EJ-S processor has a Harvard cached architecture and provides a complete high-performance processor subsystem, including the following: • An ARM9EJ-S integer core • A Memory Management Unit (MMU) Table 1. Ordering Information1 1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: Indicated by the Icon (!) Device Temperature Package MCIMX27VOP4A! –20 ° C to +85° C 1816-01 MCIMX27LVOP4A! –20 ° C to +85° C 1816-01 MCIMX27MOP4A! –40 ° C to +85° C 1931-04 MCIMX27LMOP4A! –40 ° C to +85° C 1931-04 MCIMX27VJP4A –20 ° C to +85° C 1816-01 MCIMX27LVJP4A –20 ° C to +85° C 1816-01 MCIMX27MJP4A –40 ° C to +85° C 1931-04 MCIMX27LMJP4A –40 ° C to +85° C 1931-04 |
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