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전자부품 데이터시트 검색엔진 |
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i.MX27L 데이터시트(PDF) 1 Page - Freescale Semiconductor, Inc |
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i.MX27L 데이터시트(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 148 page  Freescale Semiconductor Data Sheet, Technical Data i.MX27 and i.MX27L Package Information Plastic Package Case 1816-01 (MAPBGA–404) Case 1931-04 (MAPBGA-473) Ordering Information See Table 1 on page 4 for ordering information. Document Number: MCIMX27EC Rev. 1.5, 12/2009 © Freescale Semiconductor, Inc., 2007, 2009. All rights reserved. This document contains information on a new product. Specifications and information herein are subject to change without notice. 1 Introduction The i.MX27 and i.MX27L (MCIMX27/MX27L) Multimedia Applications Processors represents the next step in low-power, high-performance application processors. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX27 and i.MX27L processors and referred to singularly throughout this document as i.MX27. The i.MX27L does not include the following features: ATA-6 HDD Interface, Memory Stick Pro, VPU: MPEG-4/ H.263/H.264 HW encoder/decoder, and eMMA (PrP processing, CSC, deblock, dering). Based on an ARM926EJ-S™ microprocessor core, the i.MX27/27L processor provides the performance with low-power consumption required by modern digital devices such as the following: • Feature-rich cellular phones • Portable media players and mobile gaming machines • Personal digital assistants (PDAs) and wireless PDAs i.MX27 and i.MX27L Data Sheet Multimedia Applications Processor Contents 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4 2. Functional Description and Application Information . . . . 4 2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4 2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9 3. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35 3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 36 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . 40 4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40 4.2. Module-Level Electrical Specifications . . . . . . . . 43 4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54 5. Package Information and Pinout . . . . . . . . . . . . . . . . 105 5.1. Full Package Outline Drawing (17 mm × 17 mm) 105 5.2. Pin Assignments (17 mm × 17 mm) . . . . . . . . . 106 5.3. Full Package Outline Drawing (19 mm × 19 mm) 125 5.4. Pin Assignments (19 mm × 19 mm) . . . . . . . . . 126 6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 147 7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147 |
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