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ST72324J2 데이터시트(PDF) 149 Page - STMicroelectronics |
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ST72324J2 데이터시트(HTML) 149 Page - STMicroelectronics |
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149 / 164 page ![]() ST72324Jx ST72324Kx 149/164 13.3 SOLDERING INFORMATION In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level in- terconnect. The category of second level intercon- nect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to solder- ing conditions are also marked on the inner box la- bel. ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com. 1 |
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