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PIC18F23K22-E/ML 데이터시트(PDF) 463 Page - Microchip Technology |
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PIC18F23K22-E/ML 데이터시트(HTML) 463 Page - Microchip Technology |
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463 / 496 page ![]() 2010 Microchip Technology Inc. Preliminary DS41412C-page 463 PIC18(L)F2X/4XK22 29.0 PACKAGING INFORMATION 29.1 Package Marking Information 28-Lead SOIC (300 mil) XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F25K22-E/SO 0810017 28-Lead SPDIP (300 mil) XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F25K22-E/SP 0810017 Legend: XX...X Customer-specific information or Microchip part number Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e Example PIC18F25K22 0810017 3 e -E/SS 28-Lead SSOP XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN XXXXXXXX 28-Lead QFN (6mm x 6mm) XXXXXXXX YYWWNNN 18F25K22 Example -I/ML 0610017 |
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