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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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900844 데이터시트(PDF) 116 Page - Freescale Semiconductor, Inc |
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900844 데이터시트(HTML) 116 Page - Freescale Semiconductor, Inc |
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116 / 118 page  Analog Integrated Circuit Device Data 116 Freescale Semiconductor 900844 PACKAGING PACKAGE DIMENSIONS PACKAGE MECHANICAL OUTLINE DRAWING The package style is an 11x11 fine interstitial pitch, thin profile PBGA. The package has a semi populated matrix that includes 338 balls. The ball count includes 322 assigned signal pins and four sets of 4 corner balls. PACKAGE ASSEMBLY RECOMMENDATIONS For improved protection against mechanical shock, Freescale recommends applying corner glue to the mounted 900844 MAPBGA package. This corner glue application is described in the AN3954 - "PCB Layout Guidelines for SC900841 and SCCSP900842" application note. Freescale’s preferred material for the corner glue application is the Loctite 3128 board level adhesive, applied at a 0° or 45° dispense angle in a continuous motion, and with the fillet length extended to a minimum of 3 ball rows and columns, at each corner. |
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